Devices · 2h ago
Sideways HBM stacking promises cooler, faster AI memory
Researchers in Korea and Japan propose V-Die and MOSAIC designs that stack DRAM sideways instead of vertically. The approach aims to improve cooling, increase bandwidth, and enable denser stacks for AI GPUs. It could reduce reliance on TSV-heavy vertical HBM, addressing a key thermal bottleneck.
Meridian48 take
Promising lab results, but scaling sideways stacks to production will face significant manufacturing and cost hurdles.
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Researchers turn HBM on its side to tackle AI memory’s heat wall — Korean V-Die and Japanese MOSAIC designs promise higher bandwidth, denser stacks, and cooler future GPUs →
Tom's Hardware
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