Monolithic 3D AI Chip Packs 330 GB On-Die DRAM, Skips HBM

Sophon's PFG-1 ASIC integrates 330 GB of DRAM directly on the die using monolithic 3D stacking, eliminating the need for HBM. The chip targets AI inference workloads with high bandwidth and low latency. Production is slated for 2026, aiming to reduce power and cost versus traditional GPU+HBM systems.