Devices · 3h ago
Google Taps Intel EMIB for Next-Gen TPU, Bypassing TSMC CoWoS
Google reportedly selected Intel's EMIB-T packaging for its 9th-gen TPU, codenamed Humufish, over TSMC's CoWoS-L. The decision highlights Intel's growing competitiveness in advanced chip packaging amid TSMC's capacity constraints. This could signal a shift in the packaging landscape as chip designers seek alternatives.
Meridian48 take
While Google's choice validates Intel's packaging tech, it remains to be seen if other major chip designers will follow suit given TSMC's dominant market position.
Read the full reporting
Intel's EMIB packaging gains traction as chip designers look to skirt TSMC's CoWoS constraints — Google's reported decision for 9th-gen TPUs highlights Intel's attractive alternative →
Tom's Hardware
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